Papa Hoʻomoe Thermal norganic
Haʻahaʻa thermal conductivity, oi ikehu hoola
ʻAʻohe liʻiliʻi a liʻiliʻi ma hope o ka wela
ʻAʻohe chalking a ʻaʻohe hana
Ka ikaika kiʻekiʻe a me ka laulā o ka hoʻohana
Maʻalahi, olakino a pili kaiaola
ʻO ka mana maikaʻi maikaʻi, hiki ke kiʻekiʻe
E kiʻi i ka huaʻōlelo hou loa
Wehewehe pōkole
Inorganic thermal insulating board series he ʻano hou o ka refractory insulation material i hana ʻia e ka laina hana hoʻomau nui me ka hoʻohana ʻana i nā mea inorganic maʻemaʻe. ʻO ka mahana hana mai ka 900 ℃ a 1300 ℃, a hiki ke hoʻohana ʻia no ka pale hope o nā umu ʻoihana like ʻole, kahi koho maikaʻi no ka insulation wela o nā umu. Hiki ke hana ʻia ka nui nui o 0.3〜0.6 g/cm3, kahi e hoʻopiha ai i ka hakahaka ma Kina. Ma 350 degere, hiki ke hoʻomalu i ka thermal conductivity i loko o ka laulā o 0.11 〜0.13W / (mK), a hiki ke hoʻomalu i ka ikaika i loko o ka laulā o 1-2MPa, a ʻo ka nui o ka hoʻoili ʻana hiki ke 1 * 2m.
Pono
Aia ka nano-micro porosity o ka haku mele, kahi e hana ai ka huahana i ka hana insulation thermal maikaʻi.
ʻAʻole ʻoi aku ka nui o ka hoʻololi laina laina ma hope o ka 0.5% i loko o ka mahana hana i ʻōlelo ʻia, a ʻaʻole e emi i ka hoʻohana lōʻihi. ʻO ka hoʻololi ʻana o ka laina paʻa wela o ka papa insulation maʻamau a hiki i 2% -3%, a ʻoi aku ka emi ʻana ma mua o 4 mau manawa o ka papa insulation inorganic.
ʻAʻohe pulupulu, ʻaʻohe organik, nā mea ʻanoʻokoʻa a pau, ʻaʻohe chalk a ʻaʻohe hoʻohaʻahaʻa hana me ka wā lōʻihi.
Ke hoʻohālikelike ʻia me ka papa insulation thermal maʻamau, ʻoi aku ka maikaʻi o ke anuanu, ʻoi aku ia ma mua o 3 mau manawa, a he ikaika maikaʻi hoʻi ma hope o ke ahi ʻana. Hiki ke hoʻohana ʻia i ka mahana wela no ka manawa lōʻihi, ʻoi aku ka palekana a me ka laulā o ka hoʻohana.
Hōʻike
A. Nui mau: 400 x600mm, mānoanoa 30-80mm.
B. Hiki ke hoʻopilikinoʻia ka nui e like me ka makemake o nā mea kūʻai.
| Ke Ana Hoʻohālike | RS-B0.35 | RS-B0.55 | RS-B0.6 |
| BD,(g/cm3) | ≤0.35 | ≤0.55 | ≤0.6 |
| CCS,(Mpa) | ≥0.8 | ≥2.0 | ≥2.0 |
| TC,400 ℃(W/m·K) | ≤0.105 | ≤0.115 | ≤0.12 |
| PLC,% | ±0.5% 950 ℃×12h | ±0.5% 1050 ℃×12h | ±0.5% 1250 ℃×12h |
Nā noi maʻamau
Hiki ke hoʻohana ʻia no ka insulation back lining o nā umu, me ka umu wela wela a me ka ʻōwili ʻana i ke kapuahi hoʻoheheʻe kila ma ka ʻoihana metallurgical, roller kiln i ka ʻoihana ceramic, decomposition furnace i ka ʻoihana sima, electrolytic tank i ka ʻoihana alumini electrolytic,
i ka umu ahi ma ka ʻoihana kemika.
A) Pāpā kākoʻo o Roller Kiln i loko o ka ʻoihana seramika
Hoʻohana: Ceramic roller kiln wall insulation backing plate, lalo ke kākoʻo insulation.
